Features
- Flexible
- Thixotropic
- Quick Set
- Room Temperature Cure
- Available in TriggerBond
Applications
- Bonding substrates with high or different CTEs
- Bonding plastics to metals
- General purpose, semi-flexible bonds
Substrates
- Metals
- Plastics
Downloads
Related Products

ASI 5900
Fast-Grab Hybrid Adhesive
ASI 5900 Fast Grab Hybrid Adhesive uses ASI’s innovative hybrid technology to develop immediate green strength to fixture substrates while the adhesive cures and provides a long-term, durable bond. ASI 5900 is 100% solids.It will not shrink and...

DP 1040
GASKET TAPE
A premium quality, ZERO VOC, 100% solids, UL Classified, high pressure/high velocity butyl gasket tape for commercial and residential supply and return air duct uses. DP 1040 provides a flexible seal between TDC, TDF and applied flange connections...

DP 1015
WATER BASED DUCT SEALANT
A UL Listed, Low VOC, smooth, water based, high pressure/high velocity duct sealant for commercial and residential supply and return air duct use. The consistency of DP 1015 allows for better coverage and ease of application. It exceeds...

50-3152FR
Thermally Conductive
Potting and encapsulating UL 94 V-0 listed epoxy with a CTI > 600 Volts. UL File Number E235584.

MIRACLE BOND® Repair Epoxy
Non-Sag, Easy To Dispense, Multi-Purpose Repair Epoxy
MIRACLE BOND® REPAIR EPOXY is a multi-purpose, rapid cure, bonding, and repair adhesive. Its specially formulated, non-sag property is ideal for bonding most materials and perfect for both overhead and vertical repairs, while still being easily dispensed from...

EPO-TEK® H20S
Electrically & Thermally Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic
ASI 5900
Fast-Grab Hybrid Adhesive
ASI 5900 Fast Grab Hybrid Adhesive uses ASI’s innovative hybrid technology to develop immediate green strength to fixture substrates while the adhesive cures and provides a long-term, durable bond. ASI 5900 is 100% solids.It will not shrink and...
DP 1040
GASKET TAPE
A premium quality, ZERO VOC, 100% solids, UL Classified, high pressure/high velocity butyl gasket tape for commercial and residential supply and return air duct uses. DP 1040 provides a flexible seal between TDC, TDF and applied flange connections...
DP 1015
WATER BASED DUCT SEALANT
A UL Listed, Low VOC, smooth, water based, high pressure/high velocity duct sealant for commercial and residential supply and return air duct use. The consistency of DP 1015 allows for better coverage and ease of application. It exceeds...
50-3152FR
Thermally Conductive
Potting and encapsulating UL 94 V-0 listed epoxy with a CTI > 600 Volts. UL File Number E235584.
MIRACLE BOND® Repair Epoxy
Non-Sag, Easy To Dispense, Multi-Purpose Repair Epoxy
MIRACLE BOND® REPAIR EPOXY is a multi-purpose, rapid cure, bonding, and repair adhesive. Its specially formulated, non-sag property is ideal for bonding most materials and perfect for both overhead and vertical repairs, while still being easily dispensed from...
EPO-TEK® H20S
Electrically & Thermally Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic


Get in touch to learn more
Speak to us on 401-946-5564
Contact us