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DP 3060
Low Viscosity Lagging Adhesive
A low viscosity, premium quality, UL Classified, Low VOC, water based, quick drying, low odor lagging adhesive and protective coating for indoor use. The lower viscosity of DP 3060 makes it an ideal lap adhesive for pipe insulation...
DP 5050
Water Based Weather Barrier Coating
A medium viscosity, premium quality, Low VOC, water based, high strength, quick drying, low odor weather barrier coating. DP 5050 is recommended for indoor and outdoor use where a breather mastic is required. It is used for bonding...
DP 5060
Low Viscosity Weather Barrier Coating
A premium quality, low viscosity, Low VOC, water based, high strength, quick drying, low odor weather barrier coating. DP 5060 is recommended for indoor and outdoor use where a breather mastic is required. It is used for bonding...
EPO-TEK® OE121
Underfill Epoxy Adhesive
Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...
2089
Cross Linking Outdoor Carpet Adhesive
A non-flammable, high solids, advanced cross-linking resin blend adhesive. Recommended for the interior and exterior installation of exterior grade (Action Bac®) unitary backed carpet, and rubber-backed carpet over approved substrates.
EPO-TEK® H70E
Electrically Insulating Epoxy
Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.
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