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ASI 306
Electronic Grade Self-Leveling Silicone
ASI 306 Electronic Grade Self-Leveling Silicone is a one component, RTV (room temperature vulcanizing) product that can be used for encapsulating, coating and sealing.No acetic acid or other corrosive by-products are generated during its cure which allows the...

20-2175
Thixotropic Polyurethane Encapsulant
Quick set, thixotropic polyurethane encapsulant with flow control available in TriggerBond®.

50-3141FR
Flame Retardant Epoxy Adhesive
Fast curing, flame retardant epoxy adhesive that meets UL 94 V-0 requirements. 2:! mix ratio available in dual barrel TriggerBond cartridges and in bulk packaging.

50-3112
Fast Curing Epoxy Adhesive
Fast curing epoxy adhesive with high lap shear strength available in the convenient TriggerBond® packaging.

60-7107RTR
Electronic Epoxy Adhesive
Electronic grade epoxy UV adhesive, coating, and encapsulant with a CTE of 35 ppm/C.

EPO-TEK® H70E
Electrically Insulating Epoxy
Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.
ASI 306
Electronic Grade Self-Leveling Silicone
ASI 306 Electronic Grade Self-Leveling Silicone is a one component, RTV (room temperature vulcanizing) product that can be used for encapsulating, coating and sealing.No acetic acid or other corrosive by-products are generated during its cure which allows the...
20-2175
Thixotropic Polyurethane Encapsulant
Quick set, thixotropic polyurethane encapsulant with flow control available in TriggerBond®.
50-3141FR
Flame Retardant Epoxy Adhesive
Fast curing, flame retardant epoxy adhesive that meets UL 94 V-0 requirements. 2:! mix ratio available in dual barrel TriggerBond cartridges and in bulk packaging.
50-3112
Fast Curing Epoxy Adhesive
Fast curing epoxy adhesive with high lap shear strength available in the convenient TriggerBond® packaging.
60-7107RTR
Electronic Epoxy Adhesive
Electronic grade epoxy UV adhesive, coating, and encapsulant with a CTE of 35 ppm/C.
EPO-TEK® H70E
Electrically Insulating Epoxy
Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.


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