10-3020

10-3020 Fast Cure Thixotropic Epoxy Adhesive

10-3020 is part of the 10-3005 series and is a high bond strength adhesive. 10-3020 has a quick setting time of 20 minutes at room temperature.

It is excellent for bonding plated metals, glass, wood, ceramic, felt, cement, gemstones, most plastics, rubbers, etc... This adhesive was tested for flame retardancy properties and meets the requirements of UL94HB.

A non-sag version of 10-3020 is also available.

Downloads

Type

Document Name

File Size

Safety Data Sheet

Document Name 10-3020RNSCL US SDS

File Size 301.5 KB

View

Technical Data Sheet

Document Name 10-3020NS TDS

File Size 118.6 KB

View

Technical Data Sheet

Document Name 10-3020 TDS

File Size 144.9 KB

View

Safety Data Sheet

Document Name 10-3020RBKUS SDS

File Size 338.8 KB

View

Safety Data Sheet

Document Name 10-3020CCL US SDS

File Size 242.1 KB

View

Safety Data Sheet

Document Name 10-3020CNSTR US SDS

File Size 242.3 KB

View

Brand:

Epoxies, Etc.

Technology:

Epoxy

Market:

Aerospace and Defense Automotive and Transportation Electronics Industrial Assembly

Related Products

Viewing options:

EPO-TEK® MED-OG198-55

Thixotropic UV Curing Epoxy

ISO 10993 Biocompatible Shadow Cure Capable UV curing epoxy. A translucent cationic/epoxy UV with high viscosity, high Tg, and high strength.

TDS

EPO-TEK® H65-175MP

Thermally Conductive Epoxy

EPO-TEK® H65-175MP is a single component, alumina-filled epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vauum packaging.

TDS

DP 2501

Water Based Duct Liner Adhesive

A premium grade, water based, UL Classified duct liner adhesive specifically formulated for spray, brush, roller and coil line applications. It can be used to seal cut edges of fiberglass duct liner. DP 2501 can also be used...

SDS TDS

EPO-TEK® H70S

Thermally Conductive Epoxy

Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping

SDS TDS

20-3305

Thermal Shock Resistance Epoxy

Low viscosity thermal shock epoxy with a Dielectric Strength of 1857 V/mil.

TDS

Synthetic Rubber Adhesive

Evans Adhesive's synthetic rubber adhesive line is designed for gypsum applications, delivering strong, flexible bonds with fast tack and reliable performance, ideal for demanding construction and industrial environments.