EPO-TEK® H65-175MP - Thermally Conductive Epoxy

A high viscosity, premium quality, Low VOC, water based, quick drying, low odor lagging adhesive and protective coating for indoor use. DP 3050 HV can be used for bonding and coating jackets of canvas, glass cloth and other...

Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...

Quick set, thixotropic polyurethane encapsulant with flow control available in TriggerBond®.

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronics.

EPC-OVERLAY is an all-in-one, 100% solids, solvent-free, moisture-insensitive, high-performance, multi-purpose epoxy polymer concrete overlay system. This next generation system is easy-to-use and cost-effective, combining a low-modulus epoxy resin system with a high-quality engineered blend of graded aggregate to...

EPX50LT-OVERLAY is a moisture-insensitive, low-modulus, epoxy urethane co-polymer overlay resin, designed to be applied in late season cold conditions down to 30 °F and rapid return to service applications.