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EPO-TEK® HYB-353ND-LV
Low Viscosity UV Hybrid Epoxy
A single component, high temperature hybrid epoxy for semiconductor and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a lower viscosity version of...

CONVERGENT SlabArmor™ Starter
Colloidal Silica Curing/Finishing Aid and Densifier
SlabArmor™ Starter is the original colloidal silica curing/finishing aid for concrete developed in 2009, whose popularity has skyrocketed more recently with the growing use of “thirsty” low-carbon concrete using Type- 1L cement. In addition to being an excellent...

EP100-SEAL HM
Two Component Epoxy Penetrating Sealer
EP100-SEAL HM is a highly penetrating, two-component epoxy healer/sealer.

EPO-TEK® OG198-55
Biocompatible UV Curing Epoxy
Shadow Curable UV Epoxy. Thixotropic version of EPO-TEK® OG198-54.

10-2055 Series
Thixotropic Adhesive for High CTE Substrates
General purpose, semi flexible thixotropic adhesives for high CTEsubstrates available in either a light or heavy paste.

20-3305
Thermal Shock Resistance Epoxy
Low viscosity thermal shock epoxy with a Dielectric Strength of 1857 V/mil.
EPO-TEK® HYB-353ND-LV
Low Viscosity UV Hybrid Epoxy
A single component, high temperature hybrid epoxy for semiconductor and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a lower viscosity version of...
CONVERGENT SlabArmor™ Starter
Colloidal Silica Curing/Finishing Aid and Densifier
SlabArmor™ Starter is the original colloidal silica curing/finishing aid for concrete developed in 2009, whose popularity has skyrocketed more recently with the growing use of “thirsty” low-carbon concrete using Type- 1L cement. In addition to being an excellent...
EP100-SEAL HM
Two Component Epoxy Penetrating Sealer
EP100-SEAL HM is a highly penetrating, two-component epoxy healer/sealer.
EPO-TEK® OG198-55
Biocompatible UV Curing Epoxy
Shadow Curable UV Epoxy. Thixotropic version of EPO-TEK® OG198-54.
10-2055 Series
Thixotropic Adhesive for High CTE Substrates
General purpose, semi flexible thixotropic adhesives for high CTEsubstrates available in either a light or heavy paste.
20-3305
Thermal Shock Resistance Epoxy
Low viscosity thermal shock epoxy with a Dielectric Strength of 1857 V/mil.


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