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CRACKBOND® BRIDGE-GARD
Epoxy Concrete Overlay
CRACKBOND® BRIDGE-GARD is a multi-purpose epoxy polymer concrete overlay system designed for high-stress infrastructure applications. It may be successfully applied and cured at temperatures between 65 °F and 95 °F (18 °C and 35 °C).

ACCU-GROUT
Industrial Grade Epoxy Grout
ACCU-GROUT products are three-component, pre-proportioned, industrial grade epoxy grouting systems. ACCU-GROUT is a general construction epoxy grout which is also available in high-strength (ACCU-GROUT HD) and low exotherm (ACCU-GROUT LE) formulations.

2590 / 2595 HOSES
Foam Adhesive Canister Hoses
Hoses for DP 2590 Duct Liner Adhesive and DP 2595 Closed Cell Foam Adhesive canisters. AVAILABLE IN 12 FT. LENGTHS.

EPO-TEK® OG116-31
UV Epoxy Encapsulant
Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.

EPO-TEK® H20E
Silver Filled Electrically Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.

EPO-TEK® H70S
Thermally Conductive Epoxy
Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping
CRACKBOND® BRIDGE-GARD
Epoxy Concrete Overlay
CRACKBOND® BRIDGE-GARD is a multi-purpose epoxy polymer concrete overlay system designed for high-stress infrastructure applications. It may be successfully applied and cured at temperatures between 65 °F and 95 °F (18 °C and 35 °C).
ACCU-GROUT
Industrial Grade Epoxy Grout
ACCU-GROUT products are three-component, pre-proportioned, industrial grade epoxy grouting systems. ACCU-GROUT is a general construction epoxy grout which is also available in high-strength (ACCU-GROUT HD) and low exotherm (ACCU-GROUT LE) formulations.
2590 / 2595 HOSES
Foam Adhesive Canister Hoses
Hoses for DP 2590 Duct Liner Adhesive and DP 2595 Closed Cell Foam Adhesive canisters. AVAILABLE IN 12 FT. LENGTHS.
EPO-TEK® OG116-31
UV Epoxy Encapsulant
Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.
EPO-TEK® H20E
Silver Filled Electrically Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.


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