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TRANSIL® 244(+)
Densifying Waterproofer and Chloride Ion Barrier
Transil® 244(+) is a premium Nano-Lithium® hardener, densifier, and hydrophobic sealer ideal for protecting concrete and masonry surfaces against damage from freeze-thaw cycles, moisture, and chloride ion intrusion.

CONVERGENT Pentra-Sil® (AC)
pH Neutralizing Densifier and Hardener
Pentra-Sil® (AC) is an advanced alkalinity control treatment that reacts with concrete to neutralize its pH levels. Through this permanent reaction, slab sweating and efflorescence is significantly reduced. The lithium silicate in this product also densifies and hardens...

EPO-TEK® HYB-353ND
UV Hybrid
A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking.

60-7107RTR
Electronic Epoxy Adhesive
Electronic grade epoxy UV adhesive, coating, and encapsulant with a CTE of 35 ppm/C.

EP-GEL FAST
Non-sag, high-modulus, high-strength doweling gel
EP-GEL FAST is a two-component, 100% solids, high-modulus epoxy gel adhesive that offers exceptional strength in doweling and anchoring applications.

CRACKBOND® 2300 GEL
High Strength Gel Bonding Adhesive
CRACKBOND® 2300 GEL (formerly ULTRABOND® 2300) is a two-component, 100% solids, high-strength epoxy bonding adhesive. It is a solvent free, high modulus, moisture insensitive, non-sag epoxy system. CRACKBOND® 2300 GEL is ideal for use in temperatures from 60°F...
TRANSIL® 244(+)
Densifying Waterproofer and Chloride Ion Barrier
Transil® 244(+) is a premium Nano-Lithium® hardener, densifier, and hydrophobic sealer ideal for protecting concrete and masonry surfaces against damage from freeze-thaw cycles, moisture, and chloride ion intrusion.
CONVERGENT Pentra-Sil® (AC)
pH Neutralizing Densifier and Hardener
Pentra-Sil® (AC) is an advanced alkalinity control treatment that reacts with concrete to neutralize its pH levels. Through this permanent reaction, slab sweating and efflorescence is significantly reduced. The lithium silicate in this product also densifies and hardens...
EPO-TEK® HYB-353ND
UV Hybrid
A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking.
60-7107RTR
Electronic Epoxy Adhesive
Electronic grade epoxy UV adhesive, coating, and encapsulant with a CTE of 35 ppm/C.
EP-GEL FAST
Non-sag, high-modulus, high-strength doweling gel
EP-GEL FAST is a two-component, 100% solids, high-modulus epoxy gel adhesive that offers exceptional strength in doweling and anchoring applications.
CRACKBOND® 2300 GEL
High Strength Gel Bonding Adhesive
CRACKBOND® 2300 GEL (formerly ULTRABOND® 2300) is a two-component, 100% solids, high-strength epoxy bonding adhesive. It is a solvent free, high modulus, moisture insensitive, non-sag epoxy system. CRACKBOND® 2300 GEL is ideal for use in temperatures from 60°F...


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