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EPO-TEK® HYB-353ND-TX2
UV Hybrid Epoxy
A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications.

EPO-TEK® EK1000
Conductive Silver Filled Adhesive
High thermal conductive silver filled adhesive.

EP-SLV
Low Viscosity Exposy Adhesive
EP-SLV is a 100% solids, high-modulus, moisture-insensitive, very low-viscosity epoxy adhesive for gravity feed or pressure injection of cracks in concrete. EP-SLV is a structural repair adhesive designed primarily for pressure injection and gravity feed crack repair in...

EPO-TEK® OG142-112-LH
UV Curable Epoxy Adhesive
Low halogen version of OG142-112, single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging applications.

EPO-TEK® T7109
Thermal Heatsink Adhesive
Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.

Dextrin Adhesives
Evans Adhesive dextrin products provide high-performance bonding for packaging, labeling, and paper converting. Known for their versatility, they offer consistent adhesion and easy application across a range of industrial uses.
EPO-TEK® HYB-353ND-TX2
UV Hybrid Epoxy
A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications.
EPO-TEK® EK1000
Conductive Silver Filled Adhesive
High thermal conductive silver filled adhesive.
EP-SLV
Low Viscosity Exposy Adhesive
EP-SLV is a 100% solids, high-modulus, moisture-insensitive, very low-viscosity epoxy adhesive for gravity feed or pressure injection of cracks in concrete. EP-SLV is a structural repair adhesive designed primarily for pressure injection and gravity feed crack repair in...
EPO-TEK® OG142-112-LH
UV Curable Epoxy Adhesive
Low halogen version of OG142-112, single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging applications.
EPO-TEK® T7109
Thermal Heatsink Adhesive
Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.
Dextrin Adhesives
Evans Adhesive dextrin products provide high-performance bonding for packaging, labeling, and paper converting. Known for their versatility, they offer consistent adhesion and easy application across a range of industrial uses.


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