20-2370

Downloads

Type

Document Name

File Size

Technical Data Sheet

Document Name 20-2370R TDS

File Size 170.5 KB

View

Safety Data Sheet

Document Name 20-2370PBK SDS US

File Size 286.8 KB

View

Safety Data Sheet

Document Name 20-2370ITY SDS US

File Size 296.9 KB

View

Brand:

Epoxies, Etc.

Technology:

Urethane

Market:

Aerospace and Defense Automotive and Transportation Electronics

Related Products

Viewing options:

DP DUCT WRAP FILM

Polyethylene Protective Film for Duct

DP Wrap is a polyethylene film with a high-tack adhesive designed to provide protection from moisture, dust, debris, and paint. The film is easily removed, tear resistant and UV resistant.Covering round and rectangular duct during transportation, storage and...

SDS TDS

EPO-TEK® H20E

Silver Filled Electrically Conductive Epoxy

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.

TDS

ACCU-GROUT LE

Precision Epoxy for Construction Use

ACCU-GROUT products are three-component, pre-proportioned, industrial grade epoxy grouting systems. ACCU-GROUT is a general construction epoxy grout which is also available in high-strength (ACCU-GROUT HD) and low exotherm (ACCU-GROUT LE) formulations.

SDS TDS

EPO-TEK® H70S

Thermally Conductive Epoxy

Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping

SDS TDS

60-7111RCL

UV Curable Urethane Adhesive & Encapsulant

Non-yellowing UV urethane adhesive and encapsulant.

SDS TDS

CRACKBOND® 2300 GEL

High Strength Gel Bonding Adhesive

CRACKBOND® 2300 GEL (formerly ULTRABOND® 2300) is a two-component, 100% solids, high-strength epoxy bonding adhesive. It is a solvent free, high modulus, moisture insensitive, non-sag epoxy system. CRACKBOND® 2300 GEL is ideal for use in temperatures from 60°F...