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EPO-TEK® OE121
Underfill Epoxy Adhesive
Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...
EPO-TEK® MED-301
Low Viscosity Medical Grade Epoxy
ISO 10993 Medical grade low viscosity clear epoxy with high spectral transmission.
EPC-OVERLAY
Epoxy Polymer Concrete Overlay
EPC-OVERLAY is an all-in-one, 100% solids, solvent-free, moisture-insensitive, high-performance, multi-purpose epoxy polymer concrete overlay system. This next generation system is easy-to-use and cost-effective, combining a low-modulus epoxy resin system with a high-quality engineered blend of graded aggregate to...
ULTRABOND® ASF-1000
Fast-Set Doweling Epoxy Adhesive
Fast curing, styrene free, acrylic system. Numerous DOT approvals. Available in 10 oz. and 28 oz. cartridges. Browse our selection of anchoring and doweling adhesives for vertical construction and transportation infrastructure. Learn more about cold weather epoxy and...
EPO-TEK® HYB-353ND
UV Hybrid
A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking.
ASI 0240
Adhesive Remover and Cleaner
ASI 0240 is a multi-use, sprayable liquid that can used when tooling sealants/caulk to more rapidly create a professional, clean looking seal. ASI 0240 also serves as a remover for all types of caulks, sealants, labels, capes and...
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