Downloads
Technical Data Sheet
Certifications
Related Products
EPO-TEK® OG116-31
UV Epoxy Encapsulant
Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.
EPO-TEK® OG142-87
Fiber Optic Epoxy Adhesive
Single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application.
EPO-TEK® T7109
Thermal Heatsink Adhesive
Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.
DP 2595
Closed Cell Foam Spray Adhesive
A premium quality, solvent based, high performance, fast drying, non-flammable, industrial contact insulation adhesive that is water resistant and temperature resistant to 200°F. DP 2595 is formulated for adhering closed cell foam, higher density insulation and applications that...
50-3170
Thermally Conductive Epoxy Rubber Repair Adhesive
Repairable epoxy rubber for low stress encapsulation. Also available as the premixed and frozen F50-3170BK.
DP 3050
Water Based Lagging Adhesive
A medium viscosity, premium quality, UL Classified, Low VOC, water based, quick drying, low odor lagging adhesive and protective coating for indoor use. DP 3050 can be used for bonding and coating jackets of canvas, glass cloth and...
Get in touch to learn more
Speak to us on 401-946-5564
Contact us