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CRACKBOND® EPOTHANE T3 is a low-modulus, epoxy urethane skid-resistant overlay. It may be successfully applied and cured at temperatures between 60 °F and 95 °F (16 °C and 35 °C).
EPO-TEK® H21D
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High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications.
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ISO 10993 biocompatible electrically conductive (ECA) silver-filled epoxy with electrical and high thermal conductivity. It is a well characterized and relied upon ECA, with over 40 years of successful design use.
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Fast curing, flame retardant epoxy adhesive that meets UL 94 V-0 requirements. 2:! mix ratio available in dual barrel TriggerBond cartridges and in bulk packaging.
EPO-TEK® MED-HYB-353ND
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Formulated to bond large, smooth surfaces such as formica to wood or particle board. Metal, plastic, rubber and wood veneer skins can be laminated to other smooth surfaces. Use when a permanent bond is desired. (Product 1N-C available...
CRACKBOND® EPOTHANE T3
Epoxy-Urethane Hybrid Type III Overlay
CRACKBOND® EPOTHANE T3 is a low-modulus, epoxy urethane skid-resistant overlay. It may be successfully applied and cured at temperatures between 60 °F and 95 °F (16 °C and 35 °C).
EPO-TEK® H21D
Electrically & Thermally Conductive Epoxy
High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications.
EPO-TEK® MED-H20E
Biocompatible/Electrically Conductive(ECA), Silver, Medical Grade Epoxy
ISO 10993 biocompatible electrically conductive (ECA) silver-filled epoxy with electrical and high thermal conductivity. It is a well characterized and relied upon ECA, with over 40 years of successful design use.
50-3141
Thermally Conductive
Fast curing, flame retardant epoxy adhesive that meets UL 94 V-0 requirements. 2:! mix ratio available in dual barrel TriggerBond cartridges and in bulk packaging.
EPO-TEK® MED-HYB-353ND
Medical Grade Epoxy
An ISO 10993 Medical grade, single component, UV hybrid curing epoxy for semiconductor, and fiber optic applications.
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