Certifications
Related Products

10-2055 Series
Thixotropic Adhesive for High CTE Substrates
General purpose, semi flexible thixotropic adhesives for high CTEsubstrates available in either a light or heavy paste.

DP 1090
Low Verosity Duct Sealant
A Low VOC, solvent based, premium quality, UL Classified, high pressure/high velocity duct sealant for commercial and industrial supply and return air duct use. DP 1090 can be easily caulked or brushed when temperatures reach 0º F, allowing...

EP75-SEAL
Penetrating Healer and Urethane Sealer
EP75-SEAL is a highly penetrating, two-component epoxy healer/sealer. Its rapid cure time allows traffic to re-open in less than six hours.

EPO-TEK® 301-2
Optically Transparent Epoxy Resin
Optically transparent and semiconductor grade epoxy resin with low viscosity, long pot life and good handling characteristics.

EPO-TEK® TZ101
Thermally Conductive Adhesive
Single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics.

CRACKBOND® EPOXY REPAIR PASTE
Epoxy Repair Paste
Two component, moisture insensitive, high modulus, epoxy paste available in cartridges and bulk kits. Ideal as a bonding agent, filler, capping material for crack injection or as a pick-proof sealant.
10-2055 Series
Thixotropic Adhesive for High CTE Substrates
General purpose, semi flexible thixotropic adhesives for high CTEsubstrates available in either a light or heavy paste.
DP 1090
Low Verosity Duct Sealant
A Low VOC, solvent based, premium quality, UL Classified, high pressure/high velocity duct sealant for commercial and industrial supply and return air duct use. DP 1090 can be easily caulked or brushed when temperatures reach 0º F, allowing...
EP75-SEAL
Penetrating Healer and Urethane Sealer
EP75-SEAL is a highly penetrating, two-component epoxy healer/sealer. Its rapid cure time allows traffic to re-open in less than six hours.
EPO-TEK® 301-2
Optically Transparent Epoxy Resin
Optically transparent and semiconductor grade epoxy resin with low viscosity, long pot life and good handling characteristics.
EPO-TEK® TZ101
Thermally Conductive Adhesive
Single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics.


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