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CRACKBOND® JF
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This elastomeric, Polyurea joint filler (formerly known as JF-311) allows 10-15% movement of installed joint width and can be used in temperatures between -40 °F to 120 °F (-40 °C to 49 °C). Available in cartridges and in...
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A residential use UL Listed, Low VOC, fiber reinforced, water based, high pressure/high velocity duct sealant for residential supply and return air duct use. The consistency of DP 1050 allows for easier sealing of holes and gaps often...
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Long pot life, high temperature epoxy designed for semiconductor, hybrid, fiber, and optical applications. Fiber optic adhesive designed to meet Telecordia 1221.
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Medium hardness polyurethane with excellent dielectric strength and low toxicity. Also available as faster gelling versions 20-2183 and 20-2184. Softer Shore A Hardness versions available as 20-2101, 20-2140, and 20-2160.
EPO-TEK® OG116-31
UV Epoxy Encapsulant
Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.
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UV Curable Urethane Acrylate
Low viscosity, clear UV aliphatic urethane acrylate for bonding, coating, or encapsulating.
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