Certifications
Related Products

CRACKBOND® V120 LO-MOD
Epoxy Concrete Sealer
CRACKBOND® V120 LO-MOD is a two-component, moisture insensitive, low modulus, high strength epoxy healer/sealer penetrant, designed to seal micro cracks in bridge and parking structure decks and as an overlay for high friction surface treatment. The super-low viscosity...

EPO-TEK® EK1000
Electrically Conductive Silver Filled Adhesive
High thermal conductive silver filled adhesive.

EPO-TEK® H70E
Electrically Insulating Epoxy
Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.

EPO-TEK® H20E
Silver Filled Electrically Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.

DP 2590 / DP 2590 CA
SOLVENT BASED SPRAY ADHESIVE
Premium quality, solvent based, fast drying, non-flammable liquid adhesive, pressure sensitive fiberglass duct liner insulation adhesives. They are supplied in convenient spray canister systems which are both portable and cost effective. DP 2590 CA is available as a...

CONVERGENT SlabArmor™ Starter
Colloidal Silica Curing/Finishing Aid and Densifier
SlabArmor™ Starter is the original colloidal silica curing/finishing aid for concrete developed in 2009, whose popularity has skyrocketed more recently with the growing use of “thirsty” low-carbon concrete using Type- 1L cement. In addition to being an excellent...
CRACKBOND® V120 LO-MOD
Epoxy Concrete Sealer
CRACKBOND® V120 LO-MOD is a two-component, moisture insensitive, low modulus, high strength epoxy healer/sealer penetrant, designed to seal micro cracks in bridge and parking structure decks and as an overlay for high friction surface treatment. The super-low viscosity...
EPO-TEK® EK1000
Electrically Conductive Silver Filled Adhesive
High thermal conductive silver filled adhesive.
EPO-TEK® H70E
Electrically Insulating Epoxy
Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.
EPO-TEK® H20E
Silver Filled Electrically Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.
DP 2590 / DP 2590 CA
SOLVENT BASED SPRAY ADHESIVE
Premium quality, solvent based, fast drying, non-flammable liquid adhesive, pressure sensitive fiberglass duct liner insulation adhesives. They are supplied in convenient spray canister systems which are both portable and cost effective. DP 2590 CA is available as a...
CONVERGENT SlabArmor™ Starter
Colloidal Silica Curing/Finishing Aid and Densifier
SlabArmor™ Starter is the original colloidal silica curing/finishing aid for concrete developed in 2009, whose popularity has skyrocketed more recently with the growing use of “thirsty” low-carbon concrete using Type- 1L cement. In addition to being an excellent...


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