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50-3112
Fast Curing Epoxy Adhesive
Fast curing epoxy adhesive with high lap shear strength available in the convenient TriggerBond® packaging.
EPO-TEK® H70S
Thermally Conductive Epoxy
Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping
HFP 1:1
Advanced Surface Polymer
HFP 1:1 is a moisture-insensitive, low-modulus, two component, high friction surface polymer designed for binding high friction surfacing aggregates to asphalt, concrete on grade and elevated surfaces.
ASI 306
Electronic Grade Self-Leveling Silicone
ASI 306 Electronic Grade Self-Leveling Silicone is a one component, RTV (room temperature vulcanizing) product that can be used for encapsulating, coating and sealing.No acetic acid or other corrosive by-products are generated during its cure which allows the...
20-2175
Thixotropic Polyurethane Encapsulant
Quick set, thixotropic polyurethane encapsulant with flow control available in TriggerBond®.
DP 2500
Clear Duct Liner Adhesive
A clear, premium grade, water based, UL Classified duct liner adhesive specifically formulated for spray, brush, roller and coil line applications. DP 2500 Clear eliminates many of the issues associated with over-spraying colored duct liner adhesive when fabricating...
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