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10-3003 Series
High Peel Strength Epoxy
Versatile variable mix ratio epoxy with high peel strength and outstanding thermal shock, impact, and vibration resistance. Available in regular, non sag, and high viscosities.
DP 2540 – Black / DP 2545 – White
Protective Coating for Fiberglass
A water based protective coating formulated with an EPA Registered preservative that prevents the growth of mold, mildew, and fungus on the surface of the coating. It is recommended as an encapsulant on worn or damaged fiberglass to...
DP DUCT WRAP FILM
Polyethylene Protective Film for Duct
DP Wrap is a polyethylene film with a high-tack adhesive designed to provide protection from moisture, dust, debris, and paint. The film is easily removed, tear resistant and UV resistant.Covering round and rectangular duct during transportation, storage and...
CONVERGENT SlabArmor™ Starter
Colloidal Silica Curing/Finishing Aid and Densifier
SlabArmor™ Starter is the original colloidal silica curing/finishing aid for concrete developed in 2009, whose popularity has skyrocketed more recently with the growing use of “thirsty” low-carbon concrete using Type- 1L cement. In addition to being an excellent...
EPO-TEK® OE121
Underfill Epoxy Adhesive
Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...
EPO-TEK® OE121 Black
Underfill Epoxy Adhesive
Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...
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