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50-3141
Thermally Conductive
Fast curing, flame retardant epoxy adhesive that meets UL 94 V-0 requirements. 2:! mix ratio available in dual barrel TriggerBond cartridges and in bulk packaging.
20-1625
Potting & Encapsulating
Optically clear, low viscosity, 1:1 silicone potting system. Ideal for protection from shock and vibration.
50-3152FR
Thermally Conductive
Potting and encapsulating UL 94 V-0 listed epoxy with a CTI > 600 Volts. UL File Number E235584.
20-3302
Ultra clear epoxy with an RI of 1.523 at 589 nm. High purity grade polymer system with a bubble free and glass smooth finish. Available as lower viscosity version 20-3302NCLV.
EPO-TEK® 730
General Bonding
All purpose thixotropic and room temperature-curing epoxy adhesive.
20-2362FR
Potting & Encapsulating
Flame retardant, UL 94 V-0 listed urethane. Low viscosity and low Tg makes this product ideal for cushioning and protecting sensitive electronics. UL File Number E235584.
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