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50-3141FR
Flame Retardant Epoxy Adhesive
Fast curing, flame retardant epoxy adhesive that meets UL 94 V-0 requirements. 2:1 mix ratio available in dual barrel TriggerBond cartridges and in bulk packaging.
60-7155RCL
UV Curable Potting Epoxy Resin
Potting and adhesive UV resin with very low viscosity that passes ASTM E595 low outgassing.
EPO-TEK® H70E
Electrically Insulating Epoxy
Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.
EPO-TEK® H70S
Thermally Conductive Epoxy
Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping
20-3302
Ultra Clear Epoxy Resin for Adhesives & Sealants
Ultra clear epoxy with an RI of 1.523 at 589 nm. High purity grade polymer system with a bubble free and glass smooth finish. Available as lower viscosity version 20-3302NCLV.
20-2175
Thixotropic Polyurethane Encapsulant
Quick set, thixotropic polyurethane encapsulant with flow control available in TriggerBond®.
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