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CRACKBOND® V200 HI-MOD
Low Viscosity Epoxy Sealer
CRACKBOND® V200 HI-MOD is a two-component, moisture insensitive, high modulus, high strength epoxy healer/sealer deck penetrant, designed to prolong the life of concrete by sealing cracks against moisture and preventing chloride ion intrusion. The super-low viscosity (200 cP),...

EP100-SEAL
Epoxy Concrete Healer/Sealer
EP100-SEAL is a highly penetrating, two-component epoxy healer/sealer. Its rapid cure time allows traffic to re-open in less than six hours.
10-2080
Polyurethane Adhesive
10-2080 is a general purpose, semi rigid polyurethane adhesive for bonding a wide variety of plastic and metal substrates. Its flexibility allows bonding to substrates with high coefficients of thermal expansion.

EPO-TEK® H67-MP
Thermally Conductive Epoxy
Single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.

CONVERGENT SlabArmor™ Starter
Colloidal Silica Curing/Finishing Aid and Densifier
SlabArmor™ Starter is the original colloidal silica curing/finishing aid for concrete developed in 2009, whose popularity has skyrocketed more recently with the growing use of “thirsty” low-carbon concrete using Type- 1L cement. In addition to being an excellent...

50-2369FR
Flame Retardant Potting Urethane
Flame retardant, UL 94 V-0 listed fungus resistant potting urethane. UL File Number E235584.
CRACKBOND® V200 HI-MOD
Low Viscosity Epoxy Sealer
CRACKBOND® V200 HI-MOD is a two-component, moisture insensitive, high modulus, high strength epoxy healer/sealer deck penetrant, designed to prolong the life of concrete by sealing cracks against moisture and preventing chloride ion intrusion. The super-low viscosity (200 cP),...
EP100-SEAL
Epoxy Concrete Healer/Sealer
EP100-SEAL is a highly penetrating, two-component epoxy healer/sealer. Its rapid cure time allows traffic to re-open in less than six hours.
10-2080
Polyurethane Adhesive
10-2080 is a general purpose, semi rigid polyurethane adhesive for bonding a wide variety of plastic and metal substrates. Its flexibility allows bonding to substrates with high coefficients of thermal expansion.
EPO-TEK® H67-MP
Thermally Conductive Epoxy
Single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.
CONVERGENT SlabArmor™ Starter
Colloidal Silica Curing/Finishing Aid and Densifier
SlabArmor™ Starter is the original colloidal silica curing/finishing aid for concrete developed in 2009, whose popularity has skyrocketed more recently with the growing use of “thirsty” low-carbon concrete using Type- 1L cement. In addition to being an excellent...
50-2369FR
Flame Retardant Potting Urethane
Flame retardant, UL 94 V-0 listed fungus resistant potting urethane. UL File Number E235584.


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