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EPO-TEK® H67-MP
Thermally Conductive Epoxy
Single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.
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A single component, high temperature epoxy for semiconductor, hybrid, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher viscosity version of...
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Hybrid Polymer Sealant and Adhesive
ASI 57 Hybrid Class 50 Hybrid Sealant and Adhesive is a one-part, low odor, no-sag polyether sealant that uses ASI’s innovative hybrid technology to produce a material that is ideal for a wide range of applications where a...
EPO-TEK® HYB-353ND-LV
Low Viscosity UV Hybrid Epoxy
A single component, high temperature hybrid epoxy for semiconductor and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a lower viscosity version of...
EPO-TEK® OG198-54
UV Curable Epoxy
Single component, low viscosity, electrically and thermally insulating shadow curable UV epoxy.
DP DUCT WRAP FILM
Polyethylene Protective Film for Duct
DP Wrap is a polyethylene film with a high-tack adhesive designed to provide protection from moisture, dust, debris, and paint. The film is easily removed, tear resistant and UV resistant.Covering round and rectangular duct during transportation, storage and...
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