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DP 5060
LOW VISCOSITY WATER BASED WEATHER BARRIER COATING
A premium quality, low viscosity, Low VOC, water based, high strength, quick drying, low odor weather barrier coating. DP 5060 is recommended for indoor and outdoor use where a breather mastic is required. It is used for bonding...
DP 88
SPRAY EDGE COATING
DP 88 is an aerosol spray edge coating or “duct butter” formulated to quickly and conveniently coat cut or damaged insulation.DP 88 combines the advantages of quick drying aerosol adhesives with the tack-free and flexible properties of sealants...
10-2055 Series
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General purpose, semi flexible thixotropic adhesives for high CTEsubstrates available in either a light or heavy paste.
EPO-TEK® OE121
Underfill Epoxy
Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...
60-7107RTR
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THE CRACKER®
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THE CRACKER® is a non-explosive cracking agent enabling standard demolition to be carried out with comparative accuracy. This system is virtually noiseless, vibration free and is ecologically friendly. Break Concrete With Concrete Demolition Powder-The Cracker
DP 5060
LOW VISCOSITY WATER BASED WEATHER BARRIER COATING
A premium quality, low viscosity, Low VOC, water based, high strength, quick drying, low odor weather barrier coating. DP 5060 is recommended for indoor and outdoor use where a breather mastic is required. It is used for bonding...
DP 88
SPRAY EDGE COATING
DP 88 is an aerosol spray edge coating or “duct butter” formulated to quickly and conveniently coat cut or damaged insulation.DP 88 combines the advantages of quick drying aerosol adhesives with the tack-free and flexible properties of sealants...
10-2055 Series
Adhesives & Sealants
General purpose, semi flexible thixotropic adhesives for high CTEsubstrates available in either a light or heavy paste.
EPO-TEK® OE121
Underfill Epoxy
Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...
60-7107RTR
UV Curable
Electronic grade epoxy UV adhesive, coating, and encapsulant with a CTE of 35 ppm/C.
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