50-2366FR
Thermally Conductive Polyurethane Potting Compound
50-2366FR is a thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure.
50-2368FR
Thermally Conductive Polyurethane Potting Compound
50-2368FR is a thermally conductive polyurethane potting compound. This is a faster gelling version of 50-2366FR. 50-2368FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties
50-2369FR
Flame Retardant Potting Urethane
Flame retardant, UL 94 V-0 listed fungus resistant potting urethane. UL File Number E235584.
50-3100
High Thermal Conductivity Heat Transfer Epoxy Resin
50-3100R is designed for the fastest and most continuous high heat transfer. 50-3100R measures several times faster heat dissipation than other commercially available types. The most important breakthrough is the handling of 50-3100R. This system can be easily...
50-3107
Low Viscosity Epoxy Potting Compound
50-3107 is a two-component potting and encapsulating compound. This system is designed to be self-extinguishing and meets the stringent requirements of UL 94-V0. 50-3107 is thermally conductive and is RoHS compliant.
50-3112
Fast Curing Epoxy Adhesive
Fast curing epoxy adhesive with high lap shear strength available in the convenient TriggerBond® packaging.
50-3116
Thermally Conductive Flexible Epoxy Resin
50-3116 thermally conductive flexible epoxy formulation is designed for applications that require low stress during cure and electrical insulation.
50-3120
One Component Thermally Conductive Epoxy
50-3120 is a filled, single component, thermally conductive, electrically insulating epoxy system. This material is thixotropic and designed for the placement of SMD's on printed circuit boards or other substrates prior to wave soldering. It may also be...
50-3122
One Component Thermally Conductive & Electrically Insulating Epoxy Adhesive
50-3122 is a one component epoxy adhesive with a unique combination of physical properties. 50-3122 passes NASA’s outgassing requirements per ASTM E595-07. 50-3122 is both a thermally conductive and electrically insulating epoxy adhesive. It is suitable for electronic,...
