50-3185
Thermally Conductive Potting & Encapsulating Resin
50-3185NC is a filled epoxy encapsulant possessing excellent physical, electrical, and thermal properties. 50-3185NC is an excellent choice where low thermal expansion, outstanding electrical insulation and/or high thermal conductivity is required.
50-3186
Very High Temperature Resistant Epoxy Adhesive
50-3186NC is a two-part thermally conductive epoxy adhesive. This thixotropic adhesive provides high temperature bonds to a variety of substrates. 50-3186NC is a perfect choice for applications requiring high thermal conductivity, low thermal expansion, and high operating temperature...
50-3253
Flame Retardant Thermally Conductive Epoxy Resin
50-3253FR Potting and Encapsulating Compound has been formulated to meet the stringent nonburning requirements of UL 94 V-0. This medium viscosity system offers high thermal conductivity, low shrinkage, low exotherm, and outstanding electrical insulation properties.
60-7105
UV Curable Adhesive, Coating & Potting Compound
UV Cure 60-7105 is a low viscosity urethane adhesive, coating and potting compound. This UV curable resin exhibits outstanding adhesion, toughness, and exterior durability. This material is a good choice for deep section curing.
60-7107RTR
Electronic Epoxy Adhesive
Electronic grade epoxy UV adhesive, coating, and encapsulant with a CTE of 35 ppm/C.
60-7108RCL
Non-Yellowing Adhesive UV Compound
60-7108RCL is a low viscosity and optically clear UV curable system. It is designed for fiber optic and other clear adhesive or potting applications. 60-7108RCL is a good choice for electronic assemblies due to its electrical insulation properties...
60-7111RCL
UV Curable Urethane Adhesive & Encapsulant
Non-yellowing UV urethane adhesive and encapsulant.
60-7112RCL
Electronic UV Adhesive & Encapsulant
UV Cure 60-7112RCL is a higher viscosity version of the 60-7111RCL.
60-7155RCL
UV Curable Potting Epoxy Resin
Potting and adhesive UV resin with very low viscosity that passes ASTM E595 low outgassing.
