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EPO-TEK® H70E
Thermally Conductive Adhesive
Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.
SDS
TDS
EPO-TEK® OG142-87
UV Curable Epoxy
Single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application.
SDS
TDS
EPO-TEK® OG198-55
UV Curable Epoxy
Shadow Curable UV Epoxy. Thixotropic version of EPO-TEK® OG198-54.
SDS
TDS
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