EPO-TEK® OG142-112
UV Cure Optical Epoxy
This single component, low viscosity epoxy is designed for adhesive sealing and encasulating fiber optic and opto-clectronic packaging applications.
EPO-TEK® OG154-1
UV Optical Cure
A single compound UV curable epoxy adhesive for the semiconductor, opto-electronics, medical, and scientific OEM industry.
EPO-TEK® OG159-2
Epoxy-Based Thermal Post-Cure
EPO-TEK® OG159-2 is a single component, high-viscosity, UV-curable epoxy for bonding glass plates in display applications. It’s thixotropic, moisture-resistant, and includes 1 mil glass beads for bond line control.
EPO-TEK® OG198-54
UV Curable Epoxy
Single component, low viscosity, electrically and thermally insulating shadow curable UV epoxy.
EPO-TEK® OG198-55
Biocompatible UV Curing Epoxy
Shadow Curable UV Epoxy. Thixotropic version of EPO-TEK® OG198-54.
EPO-TEK® OG603
Acrylate-Based UV Cure
This all-purpose general adhesive is a single-component, low viscosity, UV-curable formula that cures in seconds for optical applications, medical uses, and PCB-level electro-optics. It is also suitable for sealing and coating applications.
EPO-TEK® UD1214
Dual UV-Thermally Curing Epoxy
Optically opaque, UV hybrid epoxy. It is especially designed for UV fast cure and following low temperature (< 80C) curing for shadow areas. It can be used as adhesive, sealing and encapsulation in semiconductor, electro-optics, fiber optics, circuit...
EPO-TEK® UD1355
Epoxy-Based Thermal Post Cure
Optically clear, low-viscosity UV adhesive and encapsulant with resistance to discoloration during solder reflow.
EPO-TEK® UD1927
UV & UV Hybrid
Single component, low viscosity UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging applications.
