EPO-TEK® UD1355 - Epoxy-Based Thermal Post Cure

Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.

ASI 12SK Butyl Sealant is a one part, butyl-based sealant formulated to perform better than the average butyl by using synthetic fibers for more flexibility, better adhesion and greater versatility.ASI 12SK provides a long-term seal between all types...

Spray guns for DP 2590 Duct Liner Adhesive and DP 2595 Closed Cell Foam Adhesive canisters.

ISO 10993 biocompatible electrically conductive (ECA) silver-filled epoxy with electrical and high thermal conductivity. It is a well characterized and relied upon ECA, with over 40 years of successful design use. 

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronics.

Seal&Shine Finish is the final step in the SlabArmor™ system, intended to be applied after the placement and finishing process. This high-performance, high-gloss finish, seals, protects and extends the life of your SlabArmor™ floor, eliminating the need for...