EPO-TEK® UD1355 - Epoxy-Based Thermal Post Cure

Optically transparent and semiconductor grade epoxy resin with low viscosity, long pot life and good handling characteristics. 

ULTRABOND® ASF-2000 is a domestically manufactured, two-component styrene free, acrylic adhesive used for anchoring and doweling applications in uncracked concrete with threaded rod and rebar. It is suitable for use in temperatures between 5 °F and 110 °F...

With slower curing for the warmest southern climates, ULTRABOND® 2 provides a long working time of 28 minutes @ 75°F (24°C) and in-service temperatures to 180°F. For anchoring threaded rod into concrete, ULTRABOND® 2 has a 1:1 mix...

ULTRABOND® EPX-3CC is everything you need, and nothing you don’t, because it’s the perfect balance between high performance and high volume. With an installation temperature range of 48 °F to 108 °F, and a full cure in 4...

EPX50-OVERLAY FAST is a fast-setting, moisture-insensitive, low-modulus, two layer chemical and waterproof epoxy urethane co-polymer overlay that provides an anti-skid surface for bridge decks, elevated slabs and PCCP. It may also be used for high friction surface treatment applications and as a binder...

A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking.