EPO-TEK® T6067
Thermally Conductive Epoxy
A single component, thermally conductive and electrically insulating epoxy designed for semiconductor die attach and bonding of SMDs for hybrid microelectronic packaging. It can be used for heat sinking, solder dam or dielectric layers in circuit assembly applications.
EPO-TEK® T7109
Thermal Heatsink Adhesive
Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.
EPO-TEK® T7109-18
Flexible Electrically Insulating Epoxy Paste
A flexible, electrically insulating epoxy paste designed for low stress and heat dissipation applications.
EPO-TEK® T7109-20
Flexible Thermally Conductive Epoxy
Flexible thermally conductive epoxy. A more flexible version of EPO-TEK® T7109-19.
EPO-TEK® T7110
Thermally Conductive Electrically Insulating Epoxy
Thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer or optics.
EPO-TEK® T7139
Glob Top Epoxy
A two component, electrically insulating, encapsulating epoxy designed for semiconductor glob top applications and package assembly.
EPO-TEK® TE109-15
Thermally Conductive Epoxy
Longer pot-life version of EPO-TEK® T7109, thermally conductive, electrically insulating epoxy for heat sinking applications.
EPO-TEK® TH106-6
Thermally Conductive Epoxy
Black, single component, low halogen, electrically insulating die attach adhesive with extended pot life.
EPO-TEK® TJ1104-LH
Low Halogen Thermally Conductive Epoxy
Black, single component, low halogen, electrically insulating die attach adhesive with extended pot life.
