
EPO-TEK® MED-OG198-55
Thixotropic UV Curing Epoxy
ISO 10993 Biocompatible Shadow Cure Capable UV curing epoxy. A translucent cationic/epoxy UV with high viscosity, high Tg, and high strength.

EPO-TEK® MED-T7110
Medical Grade Thermally Conductive Epoxy
ISO 10993 Medical grade thermally conductive epoxy, electrically insulating, low temperature curing epoxy. Ideal for temperature sensitive devices.
EPO-TEK® OD1361
Underfill Epoxy
Optically opaque epoxy specially designed as the dam component for dam and fill applications in combination with either EPO-TEK® 121-136-3 or EPO-TEK® 121-36-4 fill formulations. It can be used for adhesive, sealing, and encapsulation applications in semiconductor, electro-optics,...
EPO-TEK® OE145-4
Nonconductive Adhesive
Slightly thixotropic version of 302-3M designed to meet European regulatory requirements. It is a two component epoxy used for optical, fiber optic, and semiconductor applications. This epoxy is good for adhesive joining, sealing, potting, or as a coating.
EPO-TEK® OE145-5
Nonconductive Adhesive
A thixotropic version of 302-3M designed to meet European regulatory requirements. It is a two component slightly thixotropic epoxy used for optical, fiber optic, and semiconductor applications. This epoxy is good for adhesive joining, sealing, potting, or as...
EPO-TEK® OE145-7
Nonconductive Adhesive
Thixotropic version of EPO-TEK® 302-3M designed to meet European regulatory requirements. It is a two component epoxy used for optical, fiber optic, and semiconductor applications. Ideal for adhesive joining, sealing, potting, or as a coating.
EPO-TEK® OE188-3
Low CTE Epoxy
Two component, high Tg, low CTE epoxy designed for adhesive and sealing applications within the semiconductor, hybrid, sensor device, and fiber industries.

EPO-TEK® OG116-31
UV Epoxy Encapsulant
Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.
EPO-TEK® OG142
UV & UV Hybrid
Single component, UV curable epoxy designed for adhesive, sealing, and encapsulating applications found in semiconductor, electro-optics, fiber optics, medica, and scientific/OEM industries.


















