EPO-TEK® OE145-5 - Nonconductive Adhesive

EPO-TEK® H65-175MP is a single component, alumina-filled epoxy for hybrid die and component attach.  It can also be used for semiconductor and high temperature ceramic and vauum packaging.

EPX50-RC (Rapid Cure) delivers fast, high-strength performance for demanding infrastructure applications. This moisture-insensitive epoxy-urethane overlay meets ASTM C881 / AASHTO M235 Type III and forms a durable, waterproof, anti-skid surface ideal for bridge decks, elevated slabs, and high-friction...

A premium quality, solvent based, high performance, fast drying, non-flammable, industrial contact insulation adhesive that is water resistant and temperature resistant to 200°F. DP 2595 is formulated for adhering closed cell foam, higher density insulation and applications that...

ASI 174 Siliconized Acrylic Latex is a high performance, paintable sealant used for sealing interior and exterior joints.  ASI 174 Siliconized Acrylic Latex cures to form a strong, flexible water tight seal. ASI 174 is further modified with...

A residential use UL Listed, Low VOC, fiber reinforced, water based, high pressure/high velocity duct sealant for residential supply and return air duct use. The consistency of DP 1050 allows for easier sealing of holes and gaps often...

Room temperature-curing, thermally and electrically insulating epoxy.