EPO-TEK® OE145-5 - Nonconductive Adhesive

A premium quality, UL Listed, Low VOC, fiber reinforced, water based, high pressure/high velocity duct sealant for commercial and residential supply and return air duct use. The consistency of DP 1020 allows for easier sealing of holes and...

Shadow Curable UV Epoxy. Thixotropic version of EPO-TEK® OG198-54.

ASI 5900 Fast Grab Hybrid Adhesive uses ASI’s innovative hybrid technology to develop immediate green strength to fixture substrates while the adhesive cures and provides a long-term, durable bond. ASI 5900 is 100% solids.It will not shrink and...

Room temperature-curing, thermally and electrically insulating epoxy.

Two component, moisture insensitive, high modulus, epoxy paste available in cartridges and bulk kits. Ideal as a bonding agent, filler, capping material for crack injection or as a pick-proof sealant. 

A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking.