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Related Products

EP-GEL FAST
Non-sag, high-modulus, high-strength doweling gel
EP-GEL FAST is a two-component, 100% solids, high-modulus epoxy gel adhesive that offers exceptional strength in doweling and anchoring applications.

DP 40
Butyl Joint Sealant
A skinning, permanently flexible butyl joint sealant that is ideal for low and high temperature insulation applications. DP 40 is recommended to seal joints in cellular foam glass and remains flexible to -70° F. DP 40 acts as...

ASI 388
Electronic Grade RTV Silicone
ASI 388 Electronic Grade RTV Silicone is a one part, moisture cure sealant that cures to form a tough, durable, flexible rubber that is deal for bonding, sealing, encapsulating and protecting electronic parts.Once cured, ASI 388 will withstand...

EPO-TEK® H20S
Silver Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronics.

EP50-OVERLAY
Low Modulus Polymer Resin Overlay
EP50-OVERLAY is a solvent-free, moisture-insensitive, 100% solids, low-modulus, two-component polymer designed primarily for bonding skid-resistant overlays.

EPO-TEK® 730-110
Thermally and Electrically Insulating Epoxy
Room temperature-curing, thermally and electrically insulating epoxy.
EP-GEL FAST
Non-sag, high-modulus, high-strength doweling gel
EP-GEL FAST is a two-component, 100% solids, high-modulus epoxy gel adhesive that offers exceptional strength in doweling and anchoring applications.
DP 40
Butyl Joint Sealant
A skinning, permanently flexible butyl joint sealant that is ideal for low and high temperature insulation applications. DP 40 is recommended to seal joints in cellular foam glass and remains flexible to -70° F. DP 40 acts as...
ASI 388
Electronic Grade RTV Silicone
ASI 388 Electronic Grade RTV Silicone is a one part, moisture cure sealant that cures to form a tough, durable, flexible rubber that is deal for bonding, sealing, encapsulating and protecting electronic parts.Once cured, ASI 388 will withstand...
EPO-TEK® H20S
Silver Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronics.
EP50-OVERLAY
Low Modulus Polymer Resin Overlay
EP50-OVERLAY is a solvent-free, moisture-insensitive, 100% solids, low-modulus, two-component polymer designed primarily for bonding skid-resistant overlays.


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