EPO-TEK® OD1361

EPO-TEK® OD1361 Underfill Epoxy

Optically opaque epoxy specially designed as the dam component for dam and fill applications in combination with either EPO-TEK® 121-136-3 or EPO-TEK® 121-36-4 fill formulations. It can be used for adhesive, sealing, and encapsulation applications in semiconductor, electro-optics, fiber optics, circuit assembly, medical, and scientific/OEM industries as well as for blocking our light in opto-packages.

SDS TDS

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Document Name

File Size

Technical Data Sheet

Document Name EPO-TEK® OD1361 TDS

File Size 529.1 KB

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Safety Data Sheet

Document Name EPO-TEK® OD1361 SDS

File Size 408.5 KB

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Brand:

Epoxy Technology

Technology:

Epoxy

Market:

Electronics

Function:

Bonding Encapsulation Sealing

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