Certifications
Related Products

EPO-TEK® H67-MP
Thermally Conductive Epoxy
Single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.
10-2080
Polyurethane Adhesive
10-2080 is a general purpose, semi rigid polyurethane adhesive for bonding a wide variety of plastic and metal substrates. Its flexibility allows bonding to substrates with high coefficients of thermal expansion.

EPO-TEK® H35-175MP
Low Outgassing Silver Epoxy
Low outgassing silver Epoxy meeting MIL-STD 883 /5011 and NASA ASTM E585.

CONVERGENT Pentra-Sil® (H)
Lithium Densifier for Large Format Warehouses and Data Centers
Pentra-Sil® (H) provides efficient and economic maximum densification for large format industrial warehouses and data centers. This lithium silicate “time of placement” reactive densifier significantly reduces wear due to abrasion while eliminating concrete dusting, and makes the surface...

EPO-TEK® OG116-31
UV Epoxy Encapsulant
Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.

EPO-TEK® OG198-55
Biocompatible UV Curing Epoxy
Shadow Curable UV Epoxy. Thixotropic version of EPO-TEK® OG198-54.
EPO-TEK® H67-MP
Thermally Conductive Epoxy
Single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.
10-2080
Polyurethane Adhesive
10-2080 is a general purpose, semi rigid polyurethane adhesive for bonding a wide variety of plastic and metal substrates. Its flexibility allows bonding to substrates with high coefficients of thermal expansion.
EPO-TEK® H35-175MP
Low Outgassing Silver Epoxy
Low outgassing silver Epoxy meeting MIL-STD 883 /5011 and NASA ASTM E585.
CONVERGENT Pentra-Sil® (H)
Lithium Densifier for Large Format Warehouses and Data Centers
Pentra-Sil® (H) provides efficient and economic maximum densification for large format industrial warehouses and data centers. This lithium silicate “time of placement” reactive densifier significantly reduces wear due to abrasion while eliminating concrete dusting, and makes the surface...
EPO-TEK® OG116-31
UV Epoxy Encapsulant
Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.
EPO-TEK® OG198-55
Biocompatible UV Curing Epoxy
Shadow Curable UV Epoxy. Thixotropic version of EPO-TEK® OG198-54.


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