EPO-TEK® MED-HYB-353ND
Medical Grade UV Hybrid Epoxy
An ISO 10993 Medical grade, single component, UV hybrid curing epoxy for semiconductor, and fiber optic applications.
EPO-TEK® MED-OG198-54
UV & UV Hybrid
EPO-TEK® MED-OG198-54 is a biocompatible, clear, low viscosity, high Tg, high strength, cationic/epoxy UV curing adhesive. It has capillary wicking and is capable of reaching shadowed regions using an oven post cure. It is used in many types...
EPO-TEK® MED-OG198-55
Thixotropic UV Curing Epoxy
ISO 10993 Biocompatible Shadow Cure Capable UV curing epoxy. A translucent cationic/epoxy UV with high viscosity, high Tg, and high strength.
EPO-TEK® MED-T7110
Medical Grade Thermally Conductive Epoxy
ISO 10993 Medical grade thermally conductive epoxy, electrically insulating, low temperature curing epoxy. Ideal for temperature sensitive devices.
EPO-TEK® OE145-5
Nonconductive Adhesive
A thixotropic version of 302-3M designed to meet European regulatory requirements. It is a two component slightly thixotropic epoxy used for optical, fiber optic, and semiconductor applications. This epoxy is good for adhesive joining, sealing, potting, or as...
EPO-TEK® OE145-7
Nonconductive Adhesive
Thixotropic version of EPO-TEK® 302-3M designed to meet European regulatory requirements. It is a two component epoxy used for optical, fiber optic, and semiconductor applications. Ideal for adhesive joining, sealing, potting, or as a coating.
EPO-TEK® OE175-2
Hight Temperature Epoxy
Two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. It is a modified alternative to EPO-TEK® 375 with improved wetting.
EPO-TEK® OE184
Nonconductive Adhesive
A two component, high Tg, optically clear epoxy for packaging and assembly of fiber optics cables and components. It is suggested for termination of fibers into ferrules, or fabrication of waveguide devices. It is a faster curing alternative...
EPO-TEK® OE188-3
Low CTE Epoxy
Two component, high Tg, low CTE epoxy designed for adhesive and sealing applications within the semiconductor, hybrid, sensor device, and fiber industries.
