EPO-TEK® 353NDP
PROPEL FORWARD WITH EPO-TEK® 353NDP
Meet the next generation of high-performance solutions. EPO-TEK® 353NDP takes reliability, durability, and efficiency to unprecedented levels—crafted for the challenges of the AI and Machine Learning era, and critical industries like Datacom & Telecom, Defense, Aerospace, and Automotive. ...
EPO-TEK® 323LP
High Temperature Optical Epoxy
Long pot life, high temperature epoxy designed for semiconductor, hybrid, fiber, and optical applications. Fiber optic adhesive designed to meet Telecordia 1221.
EPO-TEK® 353ND
Low Outgassing Optical Epoxy
High Temperature Resistance & Low outgassing Epoxy Meeting NASA ASTM E595 & Telcordia GR-1221.
EPO-TEK® 930-4
Thermally Conductive Epoxy Adhesive
Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe.
EPO-TEK® EK1000
Conductive Silver Filled Adhesive
High thermal conductive silver filled adhesive.
EPO-TEK® H20E
Silver Filled Electrically Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.
