EPO-TEK® 301-2
Optical Grade Epoxy
Optically transparent and semiconductor grade epoxy resin with low viscosity, long pot life and good handling characteristics.
EPO-TEK® 323LP
Optical Grade Epoxy
Long pot life, high temperature epoxy designed for semiconductor, hybrid, fiber, and optical applications. Fiber optic adhesive designed to meet Telecordia 1221.
EPO-TEK® MED-301-2
Medical Grade Epoxy
ISO 10993 Tested/Fully Compliant, Clear and colorless, Low viscosity, room temperature curing epoxy.
EPO-TEK® OE121
Underfill Epoxy
Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...
EPO-TEK® OE121 Black
Underfill Epoxy
Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...
