EPO-TEK® H74F

EPO-TEK® H74F Thermally Conductive Epoxy

A two component, high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. It may be used for flip chip underfill, sealing sensor devices packaged in TO-cans or fiber optic feed-through. It may be considered a finer particle version of EPO-TEK® H74.

SDS TDS

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Type

Document Name

File Size

Technical Data Sheet

Document Name EPO-TEK® H74F TDS

File Size 460.0 KB

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Safety Data Sheet

Document Name EPO-TEK® H74F SDS

File Size 646.5 KB

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Brand:

Epoxy Technology

Technology:

Epoxy

Market:

Electronics

Function:

Sealing Underfill

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