EPO-TEK® 301-1 - Spectrally Transparent Epoxy

With slower curing for the warmest southern climates, ULTRABOND® 2 provides a long working time of 28 minutes @ 75°F (24°C) and in-service temperatures to 180°F. For anchoring threaded rod into concrete, ULTRABOND® 2 has a 1:1 mix...

Potting and adhesive UV resin with very low viscosity that passes ASTM E595 low outgassing.

Highly thixotropic epoxy with non-flowing properties and high temperature resistance. 

Single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.

SlabArmor™ Starter is a colloidal silica concrete curing/finishing aid and hardener used in the placement and finishing of new concrete. Its hydrophilic property holds bleed water in the capillaries of the concrete slab during the curing process, reducing...

Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping