EPO-TEK® 302-3M-R - Optically Transparent Epoxy

A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. 

General purpose, semi flexible thixotropic adhesives for high CTEsubstrates available in either a light or heavy paste.

Single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.

Fast curing, flame retardant epoxy adhesive that meets UL 94 V-0 requirements. 2:1 mix ratio available in dual barrel TriggerBond cartridges and in bulk packaging.

EPX50-OVERLAY is a moisture-insensitive, low-modulus, 3/8” two layer chemical and waterproof epoxy urethane co-polymer overlay that provides an anti-skid surface for bridge decks, elevated slabs and PCCP. It may also be used for high friction surface treatment applications and as...

For use in cracked and uncracked normal weight and lightweight concrete, ULTRABOND ACRYL-8CC has a full cure rate of 45 minutes at 70° F (21° C) and an 18-month shelf life. With an extended in-service temperature range of...