EPO-TEK® 302-3M-R - Optically Transparent Epoxy

Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.

Black-colored and optically opaque epoxy designed for optical and optoelectronic packaging of semiconductor devices and components. It is a widely used fiber-optic grade epoxy. 

Low viscosity thermal shock epoxy with a Dielectric Strength of 1857 V/mil.

CRACKBOND® V65 HI-MOD (formerly known as CRACKBOND® HEALER/SEALER) is a two-component, deep penetrating, fast cure, high strength epoxy coating that will reduce intrusion of moisture and water soluble materials into concrete. The ultra-low viscosity (65 cP) allows superior...

Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.

Hoses for DP 2590 Duct Liner Adhesive and DP 2595 Closed Cell Foam Adhesive canisters. AVAILABLE IN 12 FT. LENGTHS.