EPO-TEK® 302-3M - Optically Transparent Epoxy

ASI 5900

Fast Grab Adhesive

ASI 5900 Fast Grab Hybrid Adhesive uses ASI’s innovative hybrid technology to develop immediate green strength to fixture substrates while the adhesive cures and provides a long-term, durable bond. ASI 5900 is 100% solids.It will not shrink and...

EPO-TEK® OE121 Black

Underfill Epoxy Adhesive

Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...

EPO-TEK® 353NDP

PROPEL FORWARD WITH EPO-TEK® 353NDP

Meet the next generation of high-performance solutions. EPO-TEK® 353NDP takes reliability, durability, and efficiency to unprecedented levels—crafted for the challenges of the AI and Machine Learning era, and critical industries like Datacom & Telecom, Defense, Aerospace, and Automotive. ...

CONVERGENT SlabArmor™ Starter

Colloidal Silica Concrete Curing/Finishing Aid and Hardener

SlabArmor™ Starter is a colloidal silica concrete curing/finishing aid and hardener used in the placement and finishing of new concrete. Its hydrophilic property holds bleed water in the capillaries of the concrete slab during the curing process, reducing...

EPOXY CRACK KIT

Epoxy Concrete Crack Repair Kit

EPO-TEK® T7110

Thermally Conductive Electrically Insulating Epoxy

Thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer or optics.