EPO-TEK® 354-T2 - High Temperature, Optical Epoxy

Low stress and low temperature cure temperature version of H35-175MP.

Optically clear, low viscosity, 1:1 silicone potting system. Ideal for protection from shock and vibration. 

Single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics. 

EP15-GROUT XP is a low exotherm formulation of our EP15-GROUT product, providing an extended pot life that makes it more user friendly for warm weather applications and deep pour projects that require more working time. This high-performance epoxy...

Water resistant, room temperature cure adhesive that meets FDA regulations Sections 175.105 and 175.300 permitting use in "indirect" food contact applications.

ISO 10993 biocompatible electrically conductive (ECA) silver-filled epoxy with electrical and high thermal conductivity. It is a well characterized and relied upon ECA, with over 40 years of successful design use.