EPO-TEK® 730 - Thixotropic Epoxy Adhesive

ISO 10993 Biocompatible Shadow Cure Capable UV curing epoxy. A translucent cationic/epoxy UV with high viscosity, high Tg, and high strength.

EP50-OVERLAY is a solvent-free, moisture-insensitive, 100% solids, low-modulus, two-component polymer designed primarily for bonding skid-resistant overlays.

EP50-SC (Standard Cure) is a moisture-insensitive, 100% solids epoxy polymer engineered for skid-resistant overlay systems and other demanding infrastructure applications. Designed to provide exceptional bond strength, high early strength, and long-term durability, EP50-SC delivers reliable performance on bridge...

Rapid curing, polyurea control joint filler designed for heavy duty traffic and freezer applications. Low viscosity, self leveling and allows for 10-15% movement of installed joint width. Available in cartridges and bulk. 

ASI Compound 70 Multi-Purpose Silicone Grease is a moisture resistant, non-curing paste which retains its consistency and properties over a temperature range of -70°F to 400°F.This stiff, tacky compound is non-melting and retains its properties over extended periods...

Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...