EPO-TEK® 730 - Thixotropic Epoxy Adhesive

A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. 

Optically clear, low viscosity, 1:1 silicone potting system. Ideal for protection from shock and vibration. 

Aluminum filled epoxy with excellent thermal conductivity that passes ASTM E595 NASA low outgassing.

CRACKBOND® JF-90 HD is a two component, moisture insensitive heavy duty epoxy joint filler and crack filling material. Its semi-rigid design allows for use in industrial floors exposed to hard-wheeled forklift traffic. It shaves easily and may be...

Not only is it remarkably easy to apply, but it can be applied at temperatures as low as 25°F – and no rinsing is required, making it not only simple but also easy on the environment. It can...

Seal&Shine Finish is the final step in the SlabArmor™ system, intended to be applied after the placement and finishing process. This high-performance, high-gloss finish, seals, protects and extends the life of your SlabArmor™ floor, eliminating the need for...