EPO-TEK® B9126-8 - Thermally Conductive Epoxy

High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications. 

Smooth, non-sag, non-abrasive consistency ideal for use in bulk dispensing systems without adverse wear on pumps. Extensive DOT approvals. Available in cartridges and bulk with ATC. 

Room temperature-curing, thermally and electrically insulating epoxy.

Concrete weare surface extender with anti-scaling treatment.

EP-SLV is a 100% solids, high-modulus, moisture-insensitive, very low-viscosity epoxy adhesive for gravity feed or pressure injection of cracks in concrete. EP-SLV is a structural repair adhesive designed primarily for pressure injection and gravity feed crack repair in...

SlabArmor™ Starter is the original colloidal silica curing/finishing aid for concrete developed in 2009, whose popularity has skyrocketed more recently with the growing use of “thirsty” low-carbon concrete using Type- 1L cement. In addition to being an excellent...