EPO-TEK® CF-6 - Hight Temperature Epoxy

HFP 1:1 is a moisture-insensitive, low-modulus, two component, high friction surface polymer designed for binding high friction surfacing aggregates to asphalt, concrete on grade and elevated surfaces.

High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications. 

SlabArmor™ Starter is the original colloidal silica curing/finishing aid for concrete developed in 2009, whose popularity has skyrocketed more recently with the growing use of “thirsty” low-carbon concrete using Type- 1L cement. In addition to being an excellent...

CRACKBOND® V200 HI-MOD is a two-component, moisture insensitive, high modulus, high strength epoxy healer/sealer deck penetrant, designed to prolong the life of concrete by sealing cracks against moisture and preventing chloride ion intrusion. The super-low viscosity (200 cP),...

ISO 10993-5 biocompatible, clear, and colorless optical-grade epoxy with low viscosity.

EP-PATCH 7040 is a three-component, high-performance, 100% solids, multi-purpose, non-shrink epoxy patching mortar. This low-modulus material offers excellent bond strength and outstanding workability, providing extended working times for higher temperature applications. The EP-PATCH 7040 system combines a high-quality epoxy resin and curing agent...