EPO-TEK® E2101 - Electrically Conductive, Silver Epoxy

ISO 10993 Tested/Fully Compliant, Clear and colorless, Low viscosity, room temperature curing epoxy.

Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.

ULTRABOND® 1300-FG is a two-component, fast-setting adhesive system that offers exceptional strength in anchoring and doweling applications. It is perfect for bonding applications that require a quick turn-around. It may be used in temperatures between 40 °F -...

ACCU-CHOCK is a two-component, high-performance, high early and ultimate strength epoxy machine chock for use in high bearing areas with negligible shrinkage and creep, fast cure and excellent flowability. If you have any more questions about Adhesives Technology...

ASI 335 Neutral Cure RTV Silicone is a one-part, non-slump, moisture cure sealant/adhesive that cures to form a tough rubber with long-term flexibility and durability.Due to the formulation, ASI 335 offers advanced adhesion to a variety of surfaces...

High Temperature  Resistance & Low outgassing Epoxy Meeting NASA ASTM E595 & Telcordia GR-1221.