EPO-TEK® E3001-6

EPO-TEK® E3001-6 Electrically Conductive, Silver-Filled Epoxy

This is a single component, electrically and thermally conductive,snap cure, die attach epoxy. It was designed for JEDEC level IC plastic packaging of semiconductors, hybrid micro-electronics and photonic device assembly. It is a single component version of EPO-TEK® E2001-6.

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Safety Data Sheet

Document Name EPO-TEK® E3001-6

File Size 167.8 KB

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Technical Data Sheet

Document Name EPO-TEK® E3001-6

File Size 747.0 KB

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Brand:

Epoxy Technology

Technology:

Epoxy

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