EPO-TEK® EJ2189 - Electrically Conductive Epoxy

Rapid curing, polyurea control joint filler designed for heavy duty traffic and freezer applications. Low viscosity, self leveling and allows for 10-15% movement of installed joint width. Available in cartridges and bulk. 

EPX50LT-OVERLAY is a moisture-insensitive, low-modulus, epoxy urethane co-polymer overlay resin, designed to be applied in late season cold conditions down to 30 °F and rapid return to service applications.

Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...

ASF-GEL is a two-component, styrene-free, epoxy acrylate adhesive gel with an extended installation range from 15°F to 95°F.

EP50-OVERLAY is a solvent-free, moisture-insensitive, 100% solids, low-modulus, two-component polymer designed primarily for bonding skid-resistant overlays.

ASI 174 Siliconized Acrylic Latex is a high performance, paintable sealant used for sealing interior and exterior joints.  ASI 174 Siliconized Acrylic Latex cures to form a strong, flexible water tight seal. ASI 174 is further modified with...