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ASI 335
Advanced Adhesion 100% Neutral Cure RTV Silicone Adhesive
ASI 335 Neutral Cure RTV Silicone is a one-part, non-slump, moisture cure sealant/adhesive that cures to form a tough rubber with long-term flexibility and durability.Due to the formulation, ASI 335 offers advanced adhesion to a variety of surfaces...
EPO-TEK® MED-OG198-55
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ISO 10993 Biocompatible Shadow Cure Capable UV curing epoxy. A translucent cationic/epoxy UV with high viscosity, high Tg, and high strength.
10-3063
Water Resistant Adhesive
Water resistant, room temperature cure adhesive that meets FDA regulations Sections 175.105 and 175.300 permitting use in "indirect" food contact applications.
CONVERGENT Pentra-Sil® (HL)
Hybrid Lithium Densifier and Hardener
Pentra-Sil® (HL) is a high-solids blended hybrid lithium densifier designed for concrete densifying and hardening in newly placed or existing slabs. Its reactive formulation fills the micro-pores of the concrete, strengthening the surface and prolonging its life. Pentra-Sil®...
ASI 57
Hybrid Polymer Sealant and Adhesive
ASI 57 Hybrid Class 50 Hybrid Sealant and Adhesive is a one-part, low odor, no-sag polyether sealant that uses ASI’s innovative hybrid technology to produce a material that is ideal for a wide range of applications where a...
EPO-TEK® H65-175MP
Thermally Conductive Epoxy
EPO-TEK® H65-175MP is a single component, alumina-filled epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vauum packaging.


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