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Related Products

CONVERGENT COLORFAST™ Stain
Long Lasting Coloured Concrete
COLORFAST™ Stain is a chemically reactive, Nano-Lithium® enhanced product that creates beautiful, durable colored concrete. High-solids treatment utilizes lithium densifier to harden and protect both interior and exterior slabs. COLORFAST™ Stain is an ideal solution for all construction...

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Hoses for DP 2590 Duct Liner Adhesive and DP 2595 Closed Cell Foam Adhesive canisters. AVAILABLE IN 12 FT. LENGTHS.

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A mid-strength epoxy grout used primarily with wind applications. Early strength profile allows faster project times and early tensioning and stacking. This grout can reach 17,000 PSI compressive strength within 48 hours of placement. The savings will help...

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CONVERGENT COLORFAST™ Stain
Long Lasting Coloured Concrete
COLORFAST™ Stain is a chemically reactive, Nano-Lithium® enhanced product that creates beautiful, durable colored concrete. High-solids treatment utilizes lithium densifier to harden and protect both interior and exterior slabs. COLORFAST™ Stain is an ideal solution for all construction...
EP50-OVERLAY
Low Modulus Polymer Resin Overlay
EP50-OVERLAY is a solvent-free, moisture-insensitive, 100% solids, low-modulus, two-component polymer designed primarily for bonding skid-resistant overlays.
2590 / 2595 HOSES
Foam Adhesive Canister Hoses
Hoses for DP 2590 Duct Liner Adhesive and DP 2595 Closed Cell Foam Adhesive canisters. AVAILABLE IN 12 FT. LENGTHS.
EP17-GROUT
Mid-Strength Epoxy Grout
A mid-strength epoxy grout used primarily with wind applications. Early strength profile allows faster project times and early tensioning and stacking. This grout can reach 17,000 PSI compressive strength within 48 hours of placement. The savings will help...
EPO-TEK® TZ101
Thermally Conductive Adhesive
Single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics.
EPO-TEK® T7109
Thermal Heatsink Adhesive
Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.


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