EPO-TEK® H20E-LC - Electrically Conductive Adhesive

EPO-TEK® H20E-LC is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. It has proven itself to be extremely reliable over many years of service and is the conductive adhesive of choice for low chloride applications.

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