EPO-TEK® H20E-MP

Features

100% solid silver filled epoxy
Complies with MIL-STD 883/Test method 5011
NASA approved low outgassing adhesive
Excellent thermal management with its high thermal conductivity
Versatile in processing and curing methods
Snap curable

Applications

Semiconductor IC packaging: Si and MEMS chip or die attach
Hybrid microelectronics : quartz crystal oscillators attach, GaAs chip attach
EMI Shielding for RF, Microwave and IR Devices
Electrical Connection for smart cards, RFID tags, speakers/microphones
Solar-Photovoltaic: electrical connection, solar cell stringging adhesives and chip attach
Opto-Electronics: fiber optic components, high power laser circuit, IR detector and LED die attach
Thermal management for heat generate chip or component

Downloads

Type

Document Name

File Size

Technical Data Sheet

Document Name epotek®

File Size 629.2 KB

View

Safety Data Sheet

Document Name H20E-MP

File Size 541.4 KB

View

Certifications

Brand:

Epoxy Technology

Technology:

Epoxy

Application:

Datacom and Telecom Microelectronics/Semiconductors Optical Sensors and Camera Modules Radar Systems, Navigation and Sensors

Market:

Aerospace and Defense Electronics Optical, Datacom and Telecom

Function:

Bonding Electrical Connection High Temperature Sealing Thermal Transfer

Available Packaging

Notes

Contact our customer service or sales representative for more information.

Related Products

Viewing options:

EPO-TEK® H35-175MP

Low Outgassing Silver Epoxy

Low outgassing silver Epoxy meeting MIL-STD 883 /5011 and NASA ASTM E585.

SDS TDS

DP DUCT WRAP FILM

Polyethylene Protective Film for Duct

DP Wrap is a polyethylene film with a high-tack adhesive designed to provide protection from moisture, dust, debris, and paint. The film is easily removed, tear resistant and UV resistant.Covering round and rectangular duct during transportation, storage and...

SDS TDS

2590 / 2595 HOSES

Foam Adhesive Canister Hoses

Hoses for DP 2590 Duct Liner Adhesive and DP 2595 Closed Cell Foam Adhesive canisters. AVAILABLE IN 12 FT. LENGTHS.

SEALANT CHIP BRUSHES

Sealant Chip Brushes

Available in 2" and 3" sizes

ASI 5900

Fast Grab Adhesive

ASI 5900 Fast Grab Hybrid Adhesive uses ASI’s innovative hybrid technology to develop immediate green strength to fixture substrates while the adhesive cures and provides a long-term, durable bond. ASI 5900 is 100% solids.It will not shrink and...

CRACKBOND® V65 HI-M0D

Ultra Low Viscosity Epoxy Concrete Repair

CRACKBOND® V65 HI-MOD (formerly known as CRACKBOND® HEALER/SEALER) is a two-component, deep penetrating, fast cure, high strength epoxy coating that will reduce intrusion of moisture and water soluble materials into concrete. The ultra-low viscosity (65 cP) allows superior...

Get in touch to learn more

Speak to us on 1-978-667-3805

EPO-TEK® H20E-MP - Electrically Conductive Silver Epoxy

Features

Applications

Downloads

Certifications