EPO-TEK® H20E-MP

Features

100% solid silver filled epoxy
Complies with MIL-STD 883/Test method 5011
NASA approved low outgassing adhesive
Excellent thermal management with its high thermal conductivity
Versatile in processing and curing methods
Snap curable

Applications

Semiconductor IC packaging: Si and MEMS chip or die attach
Hybrid microelectronics : quartz crystal oscillators attach, GaAs chip attach
EMI Shielding for RF, Microwave and IR Devices
Electrical Connection for smart cards, RFID tags, speakers/microphones
Solar-Photovoltaic: electrical connection, solar cell stringging adhesives and chip attach
Opto-Electronics: fiber optic components, high power laser circuit, IR detector and LED die attach
Thermal management for heat generate chip or component

Downloads

Certifications

Brand:

Epoxy Technology

Technology:

Epoxy

Application:

Datacom and Telecom Microelectronics/Semiconductors Optical Sensors and Camera Modules Radar Systems, Navigation and Sensors

Market:

Aerospace and Defense Electronics Optical, Datacom and Telecom

Function:

Bonding Electrical Connection High Temperature Sealing Thermal Transfer

Available Packaging

Notes

Contact our customer service or sales representative for more information.

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Get in touch to learn more

Speak to us on 1-978-667-3805

EPO-TEK® H20E-MP - Electrically & Thermally Conductive Epoxy

Features

Applications

Downloads

Certifications

Available Packaging

Notes

Related Products

EPO-TEK® 730

HFP 1:1

DP 1040

60-7111RCL

CONVERGENT Pentra-Shield®

EPO-TEK® 930-4

Get in touch to learn more

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EPO-TEK® H20E-MP - Electrically & Thermally Conductive Epoxy

Features

Applications

Downloads

Certifications

Available Packaging

Notes

Related Products

EPO-TEK® 730

HFP 1:1

DP 1040

EPO-TEK® 730

HFP 1:1

DP 1040

60-7111RCL

CONVERGENT Pentra-Shield®

EPO-TEK® 930-4

Get in touch to learn more

EPO-TEK® H20E-MP

Let's talk

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