EPO-TEK® H20S-D - Electrically Conductive Adhesive

ASI 55 Industrial & Construction Hybrid Sealant/Adhesive uses ASI’s innovative hybrid technology to provide a one part, elastomeric sealant/adhesive that will perform in a variety of demanding environments and applications without degrading.Unlike conventional polyurethanes and solvent based sealants/...

Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...

Low stress and low temperature cure temperature version of H35-175MP.

Pentra-Sil® (C&N) cleans and neutralizes concrete floors that suffer from surface sweating and efflorescence. This first step of a two-part treatment stabilizes the alkalinity in concrete surfaces by infusing lithium ions throughout the substrate.

Pentra-Finish™ (HG) is the highest performing stain and wear protection finish for polished concrete, terrazzo, masonry and other cementitious surfaces. This patented, high-gloss, easy-to-use lithium sealer, creates a microfilm that will not peel, flake or bubble and improves...

ULTRABOND® 1300-FG is a two-component, fast-setting adhesive system that offers exceptional strength in anchoring and doweling applications. It is perfect for bonding applications that require a quick turn-around. It may be used in temperatures between 40 °F -...