EPO-TEK® H35-175MPLV - Silver Conductive Epoxy

ASI 57 Hybrid Class 50 Hybrid Sealant and Adhesive is a one-part, low odor, no-sag polyether sealant that uses ASI’s innovative hybrid technology to produce a material that is ideal for a wide range of applications where a...

EP20-CHOCK is a two-component, 100% solids, high performance epoxy machine chock. It is characterized by high early and ultimate strength, high bearing area, negligible shrinkage and creep, fast cure and excellent flowability.

CRACKBOND® 2300 GEL (formerly ULTRABOND® 2300) is a two-component, 100% solids, high-strength epoxy bonding adhesive. It is a solvent free, high modulus, moisture insensitive, non-sag epoxy system. CRACKBOND® 2300 GEL is ideal for use in temperatures from 60°F...

EP50-OVERLAY is a solvent-free, moisture-insensitive, 100% solids, low-modulus, two-component polymer designed primarily for bonding skid-resistant overlays.

Low halogen version of OG142-112, single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging applications.

XD-CURE is a clear, odorless, water-based concrete curing compound that is formulated to ensure proper concretestrength development, help prevent shrinkage cracks, and leave a bondable surface for further coatings, treatments or flooring materials.