Features
- Single component silver epoxy with 28 days pot life
- Smooth flowing paste
- ≥ 10kg Die Shear Strength
- MIL-STD 883/5011 and NASA ASTM E595 low outgassing epoxy
Applications
- Semiconductor IC Packaging: Die attach
- Low stress and lower cure temperature applications
Certifications

- ASTM E595
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Low Temperature Cure EpoxyLet's talk
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