EPO-TEK® H37-MP

Features

Single component silver epoxy with 28 days pot life
Smooth flowing paste
≥ 10kg Die Shear Strength
MIL-STD 883/5011 and NASA ASTM E595 low outgassing epoxy

Applications

Semiconductor IC Packaging: Die attach
Low stress and lower cure temperature applications

Downloads

Type

Document Name

File Size

Technical Data Sheet

Document Name H37-MP

File Size 552.3 KB

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Safety Data Sheet

Document Name H37-MP

File Size 449.8 KB

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Certifications

Type

Document Name

File Size

File

Document Name Epoxy Technology - Regulatory Compliance Statement

File Size 984.5 KB

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ASTM E595

Brand:

Epoxy Technology

Technology:

Epoxy

Application:

Microelectronics/Semiconductors Optical Sensors and Camera Modules Radar Systems, Navigation and Sensors

Market:

Aerospace and Defense Electronics Optical, Datacom and Telecom

Function:

Bonding Electrical Connection High Temperature Sealing Thermal Transfer

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