Features
- Single component silver epoxy with 28 days pot life
- Smooth flowing paste
- ≥ 10kg Die Shear Strength
- MIL-STD 883/5011 and NASA ASTM E595 low outgassing epoxy
Applications
- Semiconductor IC Packaging: Die attach
- Low stress and lower cure temperature applications
Certifications

- ASTM E595
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EPO-TEK® 320
Thixotropic Optical Epoxy Adhesive
Black-colored and optically opaque epoxy designed for optical and optoelectronic packaging of semiconductor devices and components. It is a widely used fiber-optic grade epoxy.
CONVERGENT Pentra-Clean™ (DC)
Multi-Surface, Acid-Free Daily Cleaner
Pentra-Clean™ (DC) Daily Cleaner easily removes stains, dirt, grease and grime from concrete, terrazzo, natural stone and tile floor surfaces. This product is easy to use, leaves no film or residue and has a neutral pH with no...
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10-3063
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Water resistant, room temperature cure adhesive that meets FDA regulations Sections 175.105 and 175.300 permitting use in "indirect" food contact applications.
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Thermally Conductive Epoxy
Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping
20-3302
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Low Temperature Cure EpoxyLet's talk
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