EPO-TEK® H37-MP

EPO-TEK® H37-MP Electrically & Thermally Conductive Epoxy

Low stress and low temperature cure temperature version of H35-175MP.

Features

Single component silver epoxy with 28 days pot life
Smooth flowing paste
≥ 10kg Die Shear Strength
MIL-STD 883/5011 and NASA ASTM E595 low outgassing epoxy

Applications

Semiconductor IC Packaging: Die attach
Low stress and lower cure temperature applications

Certifications

Brand:

Epoxy Technology

Technology:

Epoxy

Application:

Microelectronics/Semiconductors Optical Sensors and Camera Modules Radar Systems, Navigation and Sensors

Market:

Aerospace and Defense Electronics Optical, Datacom and Telecom

Function:

Bonding Electrical Connection High Temperature Sealing Thermal Transfer

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