EPO-TEK® H37MP-2 - Silver Conductive Epoxy

Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...

Two component, moisture insensitive, high modulus, epoxy paste available in cartridges and bulk kits. Ideal as a bonding agent, filler, capping material for crack injection or as a pick-proof sealant. 

For cracked and uncracked concrete, ULTRABOND® HYB-2CC is IBC approved for application in temperatures down to 23 °F. And for jobs where a quick cure rate is required, it will cure completely in 30 minutes at 70 °F. Approved...

A premium grade, UL Listed, Low VOC, smooth, water based, UL Listed, high pressure/high velocity duct sealant for commercial and residential supply and return air duct use. DP 1010 Spray is specially formulated for application by airless sprayers...

A medium viscosity, premium quality, UL Classified, Low VOC, water based, quick drying, low odor lagging adhesive and protective coating for indoor use. DP 3050 can be used for bonding and coating jackets of canvas, glass cloth and...

EPX50LT-OVERLAY is a moisture-insensitive, low-modulus, epoxy urethane co-polymer overlay resin, designed to be applied in late season cold conditions down to 30 °F and rapid return to service applications.